Ravinder Dahiya

Ravinder Dahiya

Ravinder Dahiya is Professor in Electrical and Computer Engineering Department at Northeastern University, Boston, USA. His group (Bendable Electronics and Sustainable Technologies (BEST)) conducts fundamental research in electronic skin, flexible printed electronics and their applications in robotics, prosthetics, wearables, augmented/virtual reality and similar interactive systems. He has authored or co-authored more than 500 publications, books and submitted/granted patents and disclosures. He has led or contributed to many international projects.

Prof. Dahiya is President of IEEE Sensors Council. He is the Founding Editor-in-Chief of IEEE Journal on Flexible Electronics (J-FLEX). He has been recipient of EPSRC Fellowship, Marie Curie Fellowship and Japanese Monbusho Fellowship. He has received several awards, including Technical Achievement award from IEEE Sensors Council, Young Investigator Award from Elsevier, and 12 best journal/conference paper awards as author/co-author. He is Fellow of IEEE and the Royal Society of Edinburgh.

Electronic Skin for Interactive Intelligent Systems

Miniaturization-based advances in electronics on planar and stiff substrates have revolutionized computing and communication during the last half century. However, several emerging applications and interactive systems (e.g., robots, wearables, and future vehicles, etc.) require intelligent sensors and electronics embedded in soft and squishy materials and in flexible form factors. These requirements call for new transformative methods to realize electronics on substrates such as plastic, paper and elastomers. This talk will present some of the recent technologies (e.g., the hybrid integration of the off-the-shelf electronics, printed micro/nanostructures-based CMOS electronics, and ultra-thin chips, etc.) and how they lead to tactile interfaces such as electronic skin for various intelligent interactive systems. Electronic skin is the key enabler for advances in emerging fields such as wearables, touch or haptics based augmented reality systems and healthcare technologies. This talk will discuss these future directions.

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  • Organization
    Northeastern University, Boston, USA
  • Profession
    Professor and leader of Bendable Electronics and Sustainable Technologies (BEST) Group College of Engineering
Related sessions
17 March 2022
16:00 - 18:00 CET, Geneva | 23:00-01:00 CST, Beijing | 11:00-13:00 EST, New York
Benjamin Tee (National University of Singapore), Ravinder Dahiya (Northeastern University, Boston, USA), Tess Hellebrekers (Meta AI )...

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